迄今共发表学术论文120余篇，其中近5年以一作/通讯作者身份在Laser Photonics Rev., Corrosion Science, Expert Systems with Applications, Materials & Design, IEEE TED, IEEE EDL等高质量期刊发表论文30余篇，GS被引频次共2500+次；授权发明专利数十件；主持或参与制定各项标准8项。

近5年一作/通讯作者期刊论文：

2024年

[1]Baotong Guo, Minzhen Wen, Hongyu Tang, Sergey Lishik, Xuejun Fan, Guoqi Zhang, Jiajie Fan*（唯一通讯作者）, “Revealing The Degradation Mechanism of (Sr,Ca)AlSiN 3 :Eu 2+ Phosphor Aged Under Thermal‐Moisture‐Sulfur Conditions: A Combined Experimental and Ab Initio Study”, Laser Photonics Rev. 23008, 2024.

[2]Wei Chen, Xu Liu, Dong Hu, Xu Liu, Xi Zhu, Xuejun Fan, Guoqi Zhang, Jiajie Fan*（唯一通讯作者）, “Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging”, Materials & Design 238(10):112702, 2024.

[3]Minzhen Wen, Mesfin Seid Ibrahim, Abdulmelik Husen Meda, Guoqi Zhang, Jiajie Fan*（唯一通讯作者）, “In-Situ early anomaly detection and remaining useful lifetime prediction for high-power white LEDs with distance and entropy-based long short-term memory recurrent neural networks”, Expert Systems with Applications Volume 238, Part B, 121832, 2024.

[4]Minne Liu, Wenyu Li, Wei Chen, Mesfin S. Ibrahim, Jingkang Xiong, Guoqi Zhang, Jiajie Fan*（唯一通讯作者）, “Junction temperature and luminous flux prediction for white LED array based on electrical-photo-thermal modeling”, Case Studies in Thermal Engineering 54(3):103940, 2024.

[5]Runding Luo, Dong Hu, Cheng Qian, Xu Liu, Xuejun Fan, Guoqi Zhang, Jiajie Fan*（唯一通讯作者）, “Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging”, Microelectronics Reliability 152: 115284, 2024.

[6]Junwei Chen, Wei Chen, Liangzhu Zhang, Xuyang Yan, Jiajie Fan*（共同通讯）, Huidan Zeng*, “Tuning the thermal and insulation properties of bismuth borate glass for SiC power electronics packaging”, J Am Ceram Soc.107:2207, 2024.

2023年

[7]Wenyu Li, Wei Chen, Jing Jiang, Hongyu Tang, Guoqi Zhang, Jiajie Fan*（唯一通讯作者）, “Double-sided numerical thermal modeling of fan-out panel-level MOSFET power modules”, Case Studies in Thermal Engineering 52:103763, 2023.

[8]Dong Hu, Cheng Qian, Xu Liu, Leiming Du, Zhongchao Sun, Xuejun Fan, Guoqi Zhang, Jiajie Fan*（唯一通讯作者）, “High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling”, Journal of Materials Research and Technology 26, 3183-3200, 2023.

[9]Wei Chen, Jing Jiang, Abdulmelik H. Meda, Mesfin S. Ibrahim, Guoqi Zhang, Jiajie Fan*（唯一通讯作者）, “A Thin and Low-Inductance 1200 V SiC MOSFET Fan-Out Panel-Level Packaging With Thermal Cycling Reliability Evaluation”, IEEE Transactions on Electron Devices 70(5), 2268 - 2275, 2023.

[10]Jing Jiang, Wei Chen, Yichen Qian, Abdulmelik H. Meda, Xuejun Fan, Guoqi Zhan, Jiajie Fan*（唯一通讯作者）, “Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network”, IEEE Transactions on Components, Packaging and Manufacturing Technology 13 (4), 481 - 488, 2023.

2022年

[11]W Chen, D Cao, Y Dong, J Xiong, Y Trofimov, S Lishik, G Zhang, J Fan*（唯一通讯作者）, “Enhancing luminous flux and color rendering of laser-excited YAG:Ce3+ single crystal phosphor plate via surface roughening and low-temperature sintering a CaAlSiN3:Eu2+ phosphor-in-borate glass”, Journal of Luminescence 251, 119225, 2022.

[12]W Cai, T Jiang, J Fan*（唯一通讯作者）, “Coupling effects of thermal-humidity-sulfur aging on mechanical properties of (Ca, Sr) AlSiN3: Eu2+ phosphor/silicone composites with experimental and numerical interpretation”, Optical Materials 128, 112384, 2022.

[13]C Qian, T Gu, P Wang, W Cai, X Fan, G Zhang, J Fan*（唯一通讯作者）, “Tensile characterization and constitutive modeling of sintered nano-silver particles over a range of strain rates and temperatures”, Microelectronics Reliability 132, 114536, 2022.

[14]W Chen, Y Chen, Y Cao, Z Cui, X Fan, G Zhang, J Fan*（唯一通讯作者）, “Sulfur-Rich Ageing Mechanism of Silicone Encapsulant Used in LED Packaging: An Experimental and Molecular Dynamic Simulation Study”, Frontiers in Materials 9, 819294, 2022.

[15]Y Cao, W Chen, Y Du, G Qi, T Santos, G Zhang, J Fan*（唯一通讯作者）, “Luminous Performances Characterization of YAG: Ce3+ Phosphor/Silicone Composites Using Both Reflective and Transmissive Laser Excitations”, IEEE Photonics Journal 14 (2), 1-6, 2022.

[16]J Fan*（一作&唯一通讯作者）, D Jiang, H Zhang, D Hu, X Liu, X Fan, G Zhang, “High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging”, Results in Physics 33, 105168, 2022.

[17]J Wang, W Yuan, Z Li, Y Trofimov, S Lishik, J Fan*（唯一通讯作者）, “A neural network-assisted 3D theoretical thermoelastic solution for laminated liquid crystal elastomer plate used in restoring cardiac mechanical function”, Journal of the Mechanical Behavior of Biomedical Materials136(7):105478, 2022.

[18]J Wang, W Yuan, Z Li, Y Zhu, T Santos, J Fan*（唯一通讯作者）, “Prediction of mechanical solutions for a laminated LCEs system fusing an analytical model and neural networks”, Journal of the Mechanical Behavior of Biomedical Materials 125, 104918, 2022.

2021年

[19]D Hu, T Gu, Z Cui, S Vollebregt, X Fan, G Zhang, J Fan*（唯一通讯作者）, “Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study”, Corrosion Science, 109846, 2021.

[20]Y Qian, F Hou, J Fan*（唯一通讯作者）, Q Lv, X Fan, G Zhang, “Design of a Fan-Out Panel-Level SiC MOSFET Power Module Using Ant Colony Optimization-Back Propagation Neural Network”, IEEE Transactions on Electron Devices, 68(7): 3460 - 3467, 2021.

[21]MS Ibrahim, Z Jing, WKC Yung, J Fan*（唯一通讯作者）, “Bayesian based lifetime prediction for high-power white LEDs”, Expert Systems with Applications 185, 115627,2021.

[22]Y Cao, S Chen, Y Li, Y Du, W Chen, J Fan*（唯一通讯作者）, G Zhang, “Predication of Emission Spectra for Mixed Phosphors Using Lambert-Beer Theory and Artificial Neural Network”, RARE METAL MATERIALS AND ENGINEERING 50 (7), 2393-2398, 2021.

[23]W Yuan, J Fan*（唯一通讯作者）, L Dong, S Chen, X Fan, G Zhang, “Evaluating the moisture resistance of Y3Al5O12: Ce3+ phosphor used in high power white LED packaging”, Microelectronics Reliability 121, 114130, 2021.

[24]J Fan*（一作&唯一通讯作者）, Z Jing, Y Cao, MS Ibrahim, M Li, X Fan, G Zhang, “Prognostics of Radiation Power Degradation Lifetime for Ultraviolet Light-Emitting Diodes using Stochastic Data-driven Models”, Energy and AI, 100066, 2021

[25]J Fan*（一作&唯一通讯作者）, Y Chen, Z Jing, MS Ibrahim, M Cai, “A Gamma process-based degradation testing of silicone encapsulant used in LED packaging”, Polymer Testing 96(5):107090, 2021.

[26]MS Ibrahim, J Fan*（唯一通讯作者）, WKC Yung, Z Jing, X Fan, W van Driel, G Zhang, “System Level Reliability Assessment for High Power Light-emitting Diode Lamp based on a Bayesian Network Method”, Measurement, 109191, 2021.

2020年

[27]Zhou Jing, Jie Liu, Mesfin Seid Ibrahim, Jiajie Fan*（唯一通讯作者）, Xuejun Fan, Guoqi Zhang, Lifetime Prediction of Ultraviolet Light-Emitting Diodes Using a Long Short-Term Memory Recurrent Neural Network, IEEE Electron Device Letters, 41(12): 1817-1820, 2020.

[28]Mesfin Seid Ibrahim*, Jiajie Fan*（共同通讯作者）, Winco K. C. Yung, Alexandru Prisacaru, Willem van Driel, Xuejun Fan, Guoqi Zhang, “Machine Learning and Digital Twin Driven Diagnostics and Prognostics of Light‐Emitting Diodes”, Laser Photonics Rev. 2020, 2000254.

[29]J Fan*（一作&唯一通讯作者）, D Xu, H Zhang, C Qian, X Fan, G Zhang, Experimental investigation on the sintering kinetics of nanosilver particles used in high power electronic packaging, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020.

[30]J Fan*（一作&唯一通讯作者）, W Chen, W Yuan, X Fan, G Zhang, Dynamic prediction of optical and chromatic performances for a light-emitting diode array based on a thermal-electrical-spectral model, Optics Express 28 (9), 13921-13937, 2020.

授权发明专利（排名第一/学生第一本人第二）：

[1]樊嘉杰、钱弈晨，一种高可靠性的嵌入式SiC功率器件封装设计方法CN202110700564.6

[2]樊嘉杰、钱弈晨、侯峰泽、刘盼、张国旗，基于蚁群算法的SiC MOSFET封装结构优化方法CN202011321629.8

[3]樊嘉杰、钱弈晨、侯峰泽、刘盼、张国旗，SiC MOSFET封装结构优化设计方法、介质及设备CN202011018010.X

[4]樊嘉杰、钱弈晨，一种高可靠性的嵌入式SiC功率器件封装设计方法CN202110700564.6

[5]樊嘉杰、陈威、曹逸兴、张国旗，一种基于深紫外 LED 的生物膜细菌灭活方法CN202111393733.2

[6]樊嘉杰、蒋大伟，一种有压纳米颗粒烧结装置CN201911366414.5

[7]樊嘉杰、蒋大伟、丁柏文、经周，一种用于纳米颗粒均匀混合的装置CN201910670995.5

[8]樊嘉杰、王平、刘杰、徐丹、蒋大伟，一种功率器件纳米颗粒烧结封装夹具CN201910166647.4

[9]唐卓睿、樊嘉杰、张国旗，一种半导体薄膜生长感应加热式设备的反应腔结构CN202210272717.6

[10]江京、樊嘉杰、张国旗，一种多芯片封装结构及其制作方法CN202110195619.2

[11]樊嘉杰、陈威、谢超逸、李宇彤、刘杰，一种LED多芯片模组的光、色性能预测方法CN201910322410.0

[12]樊嘉杰、陈威、谢超逸、经周，一种多芯片LED模组的照度均匀性优化设计方法CN201910149173.2

[13]樊嘉杰、唐芝彬、陈威、费孝峰、何凯，一种反射式可控温激光激发远程荧光材料测试装置CN201910585195.3

[14]樊嘉杰、孙翔、陈威、王珍、唐芝彬、费孝峰、何凯，一种LED荧光胶的力学损伤检测装置及方法CN201910617259.3

[15]刘杰、樊嘉杰、王平、吴伟子，LED光强分布在线测试系统法CN201910089135.2

[16]樊嘉杰、钱诚、张梦妮、柏常青、张国旗，荧光胶的性能测量装置和方法CN201510583040.8

标准制定：

[1]主持起草ISA国际标准：ISA-S-0010-2020: Recommendation on Prediction for Color Maintenance of LEDs Based on A Spectral Power Distribution Decomposition Method（已发布）

[2]主持起草CASA团体标准：T/CASAS/TR 002—2023: SiC MOSFET功率器件的应用可靠性评价技术体系报告（已发布）

[3]主持起草CSA团体标准：T/CSA 047-2019 发光二极管热阻抗测试方法（已发布）

[4]参与起草国家标准：GB/T 33720-2017: LED照明产品光通量衰减加速试验方法（已发布）

[5]参与起草CSA团体标准：T/CSA 059-2020道路机动车辆后装替代卤素灯泡H1、H7的LED灯泡尺寸、光电性能要求（已发布）

[6]参与起草CSA团体标准：T/CSA 048-2019普通照明用发光二极管变电流/温度光电特性测试方法（已发布）

[7]参与起草CSA团体标准：T/CSA 088-202X 多芯片LED阵列热特性测试及评估方法（起草阶段）

[8]参与起草CSA团体标准：T/CSA 086-202X 考虑热耦合效应的LED阵列光学和色度性能评价方法（起草阶段）

IEEE国际电气与电子工程师协会高级会员、国外学术期刊IEEE-Access 期刊副主编、Microelectronics Reliability, Micromachines客座编辑、欧洲微电子及微系统热、机械及多物理场仿真和实验国际会议（EuroSimE）Section chair、国际半导体照明联盟标准化委员会WG8/25项目组组长、ISO/TC274 life cycle costs project leader（ISA提名)、第三代半导体产业技术创新战略联盟标准化委员会技术咨询委员会委员、第三代半导体产业技术创新战略联盟先进半导体领域图书编委会编委。

获奖情况

[1]2022年获中国仪器仪表学会科学技术奖（科技进步三等奖）

[2]2021年入选上海市浦江人才计划（D特殊急需类，集成电路方向）

[3]2020年获国际半导体照明联盟十周年突出贡献奖

[4]2020年获江苏省科学技术奖（三等奖）

[5]2019年获江苏省照明电器协会“江苏照明奖-十大优秀技术奖”

[6]2018年入选江苏省人社厅第十五批“六大人才高峰”高层次人才（B类）

[7]2017年入选江苏省科协首批“青年科技人才托举工程”

[8]2017年获CASA “第三代半导体卓越创新青年”称号（每年全国5-10位获奖者）

[9]2015年获“IEEE国际可靠性系统工程大会最佳论文奖”

指导学生获奖情况

[1]指导学生团队获得2023年全国首届企校创新大赛（半导体领域）一等奖/全国决赛二等奖

[2]指导学生获得2023年IFWS国际会议最佳学生Poster三等奖

[3]指导学生获得2023年第73届ECTC国际电子封装领域Top会议“Student Travel Award”（唯一入选的中国学生）

[4]指导学生获得2020年ICEPT电子封装技术国际会议最佳论文三等奖