• 新型电子封装材料

• 功率半导体模块封装技术

• 集成化功率模块封装工艺

• 半导体模块可靠性及失效机理分析

• FAET737012 – 功率半导体封装概论 – 硕博通用课程

• 天津大学，功率MOSFET半导体封装设计，2020年-2021年

• 企业项目，分段式电机控制器，2018年-2019年

• 企业项目，碳化硅电机控制器，2018年-2019年

• 企业项目，碳化硅功率模块，2018年-2019年

• 海外企业项目，宽禁带半导体功率模块的开发，2014年-2018年

• 海外企业项目，电力电子封装实验室，2013年-2014年

• 海外企业项目，纳米银焊膏的开发与测试，2008年-2009年

• Li Jiang,Thomas Guangyin Lei, Khai D.T. Ngo, Guo-Quan Lu*, and Shufang Luo,“Evaluation of Thermal Cycling Reliability of Sintered Nanosilver Versus Soldered Joints by Curvature Measurement”,IEEE Transactions on Components and Packaging Technologies, Vol. 4, No. 5, pp. 751-761, 2014

• Thomas Guangyin Lei*, Jesus Noel Calata, Guo-Quan Lu, Xu Chen, and Shufang Luo, “Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area (> 100 mm2) Chips”,IEEE Transactions on Components and Packaging Technologies, Vol. 33, No. 1, pp. 98-104, 2010

• Puqi Ning,Thomas Guangyin Lei, Fei (Fred) Wang*, Guo-Quan Lu, Khai D. T. Ngo, and Kaushik Raiashekara, “A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module”,IEEE Transactions on Power Electronics, Vol. 25, No. 8, pp. 2059-2067, 2010.

• Thomas Guangyin Lei*, Jesus Noel Calata, Khai D. T. Ngo, and Guo-Quan Lu, “Effects of Large Temperature Cycling Range on Direct Bond Aluminum Substrate”,IEEE Transactions on Device and Materials Reliability,Vol. 9, No. 4, pp. 563-568, 2009

• Guangcheng Dong,Guangyin (Thomas) Lei, Xu Chen*, Khai Ngo and Guo-Quan Lu, “Edge tail length effect on reliability of DBC substrates under thermal cycling,”Soldering & Surface Mount Technology, Vol. 21, No. 3, pp. 10-15, 2009

• Li Yan, Zengping Xing, Zhiguang Wang, Tao Wang,Guangyin Lei, Jiefang Li, D. Viehland*, “Direct measurement of magnetoelectric exchange in self-assembled epitaxial BiFeO3-CoFe2O4 nanocomposite thin films”,Applied Physics Letters, 94, 192902 (2009)

• John G. Bai,Thomas G. Lei, Jesus N. Calata, Guo-Quan Lu*, “Control of Nanosilver Sintering Attained Through Organic Binder Burnout”,J. Mater. Res., vol. 22, no. 12, pp. 3494-3500, Dec. 2007

• Tao Wang, Xu Chen*, Guo-Quan Lu, Guangyin Lei,“Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection”, J. Electronic Materials, Vol. 36, No. 10, pp. 1333-1340. 2007

• Thomas G. Lei*, Jesus Calata, Shufang Luo, Guo-Quan Lu, and Xu Chen, “Low-temperature sintering of nanoscale silver paste for large-area joints in power electronics modules”, Key Engineering Materials, Vol 353, pp. 2948-2953. 2007

• Guo-Quan Lu*, Jesus N. Calata,Guangyin Lei, and Xu Chen, “Low-temperature and Pressureless Sintering Technology for High-performance and High-temperature Interconnection of Semiconductor Devices,”Proceedings of 8th International Conference on Thermal, Mechanical, and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSime 2007, April 15th – 18th, London, UK, pp. 609-613, 2007

• Kewei Xiao,Guangyin Lei, Khai D.T. Ngo, and Guo-Quan Lu*, “Effect of Heating Rate on Bonding Strength of Pressure-Free Sintered Nanosilver Joint”,International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), pp. 565-570, 2015

• Guo-Quan Lu*, Meihua Zhao,Guangyin Lei, Jesus N. Calata, Xu Chen, and Susan Luo, “Emerging lead-free, high-temperature die-attach technology enabled by low-temperature sintering of nanoscale silver pastes”,Electronic Packaging Technology & High Density Packaging, ICEPT-HDP’09, Beijing, pp. 461-466, 2009

• John G. Bai, Jesus N. Calata,Guangyin Lei, and Guo-Quan Lu*, “Thermomechanical reliability of low-temperature sintered silver die-attachment”,The tenth Inter. Conf. on Thermal and Thermomechanical Phenomena in Electronics Systems, ITHERM 06’. pp. 1126-1130, 2006

• T. Wang,G. Lei, X. Chen*, L. Guido, Khai Ngo, G-Q Lu,“Improved performance of high-power LED by using low-temperature sintered chip attachment”,Electronic Packaging Technology & High Density Packaging, ICEPT-HDP’09, Beijing, China, pp. 581-584, 2009

• Puqi Ning,Guangyin Lei, Fred Wang* and Khai D.T. Ngo, “Selection of Heatsink and Fan for High-Temperature Power Modules under Weight Constraint,Applied Power Electronics Conference and Exposition, Twenty-Third Annual IEEE,Austin, TX, pp. 192-198, 2008

• 2020年4月至今，复旦大学工程与应用技术研究院，研究员

• 2018年1月-2020年3月，上海蔚来汽车有限公司，技术专家

• 2010年5月-2018年1月，美国福特汽车公司，研发工程师

• 2005年8月-2010年5月，美国弗吉尼亚理工大学，材料科学与工程，博士

• 2003年8月-2005年8月，美国弗吉尼亚理工大学，材料科学与工程，硕士

• 1998年9月-2003年6月，浙江大学，生物医学工程，本科

近年来承担以下学术期刊审稿工作: IEEE Transactions on Device and Materials Reliability, IEEE Transactions on Components, Packaging and Manufacturing Technology, IEEE Transactions on Electron Devices, Journal of Electronic Packaging, Journal of Electronic Materials, Material Letters, Soldering & Surface Mount Technology, Applied Optics

2007年，博士期间所开发的纳米银焊浆，nanoTach®，被评为 2007 年度最具商业价值 的 100 个产品之一，R&D 100 Award，（2/3）